CH-HTE/高溫高延伸率電解銅箔

通過(guò)對(duì)傳統(tǒng)的原箔電鍍工藝進(jìn)行改良，生產(chǎn)出高溫高延伸率電解銅箔，具有優(yōu)良的常溫與 高溫性能，具有優(yōu)良的高耐折特性，并且經(jīng)過(guò)后處理后保留優(yōu)良的結(jié)合力。/By improving the traditional original foil electroplating process, high temperature and high elongation electrolytic copper foil is produced, which has excellent properties at room temperature and high temperature, excellent folding resistance, and excellent adhesion after post-treatment.

? 適用于高密度互連技術(shù)板與柔性電路板/Suitable for HDI and FPC PCB.

產(chǎn)品/技術(shù)優(yōu)勢(shì)/Advantages of Product/ Technology

? 優(yōu)異的高溫延伸率/Excellent high temperature elongation
? 優(yōu)良的高耐折特性/Excellent folding resistance
? 較低的粗糙度/Lower roughness
? 優(yōu)良的基材結(jié)合力/Excellent substrate adhesion

產(chǎn)品/技術(shù)應(yīng)用范圍Application Area(s) of Product/ Technology

單面板、雙面板、以及所有FR-4、CEM-1、CEM-3種類(lèi)的基板/single-sided, double-sided PCB, and FR-4、CEM-1、CEM-3 substrate

代表特性數(shù)據(jù)/Representive date